Thinning of micromachined wafers for high-density, through-wafer interconnects

Wang, L; Visser, C.C.G.; de Boer, C.R.; Laros, M; van der Vlist, W.; Groeneweg, J.; Craciun, G; Sarro, Pasqualina M

Thinning of micromachined wafers for high-density, through-wafer interconnects

Conference paper (2002)

Authors

L Wang Electronic Components, Technology and Materials -

C.C.G. Visser Electronic Components, Technology and Materials -

C.R. de Boer Electronic Components, Technology and Materials -

M Laros Electronic Components, Technology and Materials -

W. van der Vlist Electronic Components, Technology and Materials -

J. Groeneweg Electronic Components, Technology and Materials -

G Craciun Electronic Instrumentation -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2002

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials