Thinning of micromachined wafers for high-density, through-wafer interconnects

Wang, L; Visser, CCG; De Boer, Charles; Laros, M; van der Vlist, W; Groeneweg, J.; Craciun, G; Sarro, Pasqualina M

Thinning of micromachined wafers for high-density, through-wafer interconnects

Conference paper (2002)

Authors

L Wang Electronic Components, Technology and Materials

CCG Visser Electronic Components, Technology and Materials

Charles De Boer Electronic Components, Technology and Materials

M Laros Electronic Components, Technology and Materials

W van der Vlist Electronic Components, Technology and Materials

J. Groeneweg Electronic Components, Technology and Materials

G Craciun Electronic Instrumentation

Pasqualina M Sarro Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2002

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Research Group

Electronic Components, Technology and Materials

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