Digital Image Sensor Evolution and New Frontiers

Review (2024)

Authors

Eric R. Fossum Thayer School of Engineering at Dartmouth
Nobukazu Teranishi Shizuoka University
A.J.P.A.M. Theuwissen Electronic Instrumentation - EEMCS , Harvest Imaging, Belgium
Research Group
Electronic Instrumentation (EEMCS) (TU Delft)
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Published Date

2024

Language

English

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Instrumentation

Abstract

This article reviews nearly 60 years of solid-state image sensor evolution and identifies potential new frontiers in the field. From early work in the 1960s, through the development of charge-coupled device image sensors, to the complementary metal oxide semiconductor image sensors now ubiquitous in our lives, we discuss highlights in the evolutionary chain. New frontiers, such as 3D stacked technology, photon-counting technology, and others, are briefly discussed.