Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology

Poliakov, A; Sinaga, SM; Bartek, M.; Burghartz, JN

Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology

Conference paper (2004)

Authors

A Poliakov Old - EWI Ch. Integrated Sensing Devices

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

M. Bartek Old - EWI Ch. Integrated Sensing Devices

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

Elektrotechniek

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Published Date

2004

Language

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Research Group

Old - EWI Ch. Integrated Sensing Devices