Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures

Journal article (2022)

Authors

Cheng Qian Fudan University

Tijian Gu Hohai University

Ping Wang Hohai University

Wei Cai Hohai University

Xuejun Fan Lamar University

Kouchi Zhang Electronic Components, Technology and Materials -

J. Fan Research Institute of Fudan University, Ningbo, Fudan University, Electronic Components, Technology and Materials - , Lamar University

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI: https://doi.org/10.1016/j.microrel.2022.114536

Constitutive model Power electronics packaging Nano-silver sintering Anand model Variable-order fractional model

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Published Date

2022

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50 nm nano-silver particles were sintered at 275 °C for 50 min as test samples, and their tensile tests were conducted under a dynamic thermomechanical analyzer (DMA Q800) and an IBTC 300SL in-situ mechanical test system respectively with different strain rates and ambient temperatures. Then, both Anand and variable-order fractional models (VoFM) were adopted to analyze the obtained stress-strain data and we studied their fitting accuracy and applicability. The results showed that: (1) The Young's modulus of the sintered nano-silver particles decreased with increasing temperature. In addition, the tensile strengths declined under lower strain rates and higher temperature conditions; (2) both the Anand model and VoFM characterized the tensile stress-strain properties of the sintered nano-silver material well. Compared to the Anand model, the VoFM utilized a simpler formula with fewer parameters and higher precision.

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