KH

K. Hatakeyama

4 records found

Authored

The semiconductor industry needs to fit ever more devices per unit area to improve their performance; hence a trend towards increasingly complex structures by varying material combinations and 3D geometries with increasing aspect ratios. The new materials used may be optically ...

In Subsurface Scanning Probe Microscopy (SSPM), Atomic Force Microscopy (AFM) is combined with ultrasound. The AFM cantilever is used as a receiver. At low frequencies (O(MHz)) the method can be used to measure the stiffness contrast in a sample and at high frequencies (O(GHz) ...

The characterization of buried nanoscale structures nondestructively is an important challenge in a number of applications, such as defect detection and metrology in the semiconductor industry. A promising technique is Subsurface Scanning Probe Microscopy (SSPM), which combine ...