Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures

Conference paper (2003)

Authors

H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
JHCM Slabbekoorn Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2003

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials