Material structure of microcrystalline silicon deposited with an expanding thermal plasma

Conference paper (2003)

Authors

C Smit Electronic Components, Technology and Materials - EEMCS
DL Williamson External organisation
MCM van de Sanden External organisation
R.A.C.M.M. van Swaaij Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
More Info
expand_more

Published Date

2003

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials