Improvement of material properties by employing external RF substrate bias during a-Si:H deposition by a remote expending thermal plasma

Smets, AHM; Petit, AMHN; Nadazdy, V; Kessels, WMM; van Swaaij, R.A.C.M.M.; van de Sanden, MCM

Improvement of material properties by employing external RF substrate bias during a-Si:H deposition by a remote expending thermal plasma

Conference paper (2005)

Authors

AHM Smets External organisation

AMHN Petit Electronic Components, Technology and Materials -

V Nadazdy Electronic Components, Technology and Materials -

WMM Kessels External organisation

R.A.C.M.M. van Swaaij Electronic Components, Technology and Materials -

MCM van de Sanden External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2005

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials