Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

Tang, J.; Ye, H.; Schelen, JBJ; Beenakker, C.I.M.

Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

Conference paper (2011)

Authors

J. Tang Electronic Components, Technology and Materials -

H. Ye Electronic Components, Technology and Materials -

JBJ Schelen External organisation

C.I.M. Beenakker Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2011

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials