Electro-deposition for high-quality conformal resist layers for MEMS

Journal article (2004)

Authors

CMA Ashruf Electronic Instrumentation - EEMCS
LDM van den Brekel External organisation
GJ Bertens Electronic Components, Technology and Materials - EEMCS
E Boellaard Electronic Components, Technology and Materials - EEMCS
PN Pham Electronic Components, Technology and Materials - EEMCS
M Heschel External organisation
Research Group
Electronic Instrumentation (EEMCS) (TU Delft)
More Info
expand_more

Published Date

2004

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Instrumentation

Abstract

Conventional spin-coating methods for photoresist deposition give poor results for MEMS and other applications where a conformal resist layer is required over wafer surfaces with large topography.We have developed a coating tool for use with electro-depositable resist that gives a resist layer with self-limiting uniform thickness across all planes of topography on a wafer surface. High quality, conformal coatings were obtained on wafers with surfaces micromachined to give challenging topography for coating. The resist was successfully patterned on the walls and bottoms of trenches in the micromachined wafers, indicating conformal and uniform resist deposition, even at sharp corners.The tool was also used in the production of a chemical sensor where multiple feedthroughs were successfully formed within single through-wafer holes to give high wiring densities.