A micromachining post-process module with pattern transfer in deep cavities for RF silicon technology

Pham, PN; Sarro, P.M.; Ng, TK; Burghartz, JN

A micromachining post-process module with pattern transfer in deep cavities for RF silicon technology

Conference paper (2001)

Authors

PN Pham Electronic Components, Technology and Materials

P.M. Sarro Electronic Components, Technology and Materials

TK Ng Old - EWI Ch. Integrated Sensing Devices

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Electronic Components, Technology and Materials

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Published Date

2001

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Research Group

Electronic Components, Technology and Materials