The effect of filler parameters on the healing of thermal conductivity and mechanical properties of a thermal interface material based on a self-healable organic-inorganic polymer matrix

Journal article (2016)

Authors

N. Zhong Novel Aerospace Materials - Aerospace Engineering

Santiago J. Garcia Novel Aerospace Materials - Aerospace Engineering

S. van der Zwaag Novel Aerospace Materials - Aerospace Engineering

Research Group

Novel Aerospace Materials (Aerospace Engineering) (TU Delft)

Thermal conductivity Fracture strength Self-healing polymers Organic-inorganic networks Tetrasulfides Thermal interface materials

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Published Date

15-07-2016

Language

English

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Faculty

Aerospace Engineering

Department

Aerospace Structures & Materials

Research Group

Novel Aerospace Materials

Abstract

Thermal interface materials (TIMs) are widely used in all kinds of electronic devices to handle the heat dissipation and the mechanical anchoring of the heat producing component. The aging of TIMs may lead to delamination and internal crack formation causing a loss of heat transfer and mechanical integrity both leading to premature device failure. In the present work, a novel TIM system based on a self-healing organic-inorganic polymer matrix filled with spherical glass beads is presented which is capable of healing both the thermal conductivity and the mechanical properties upon thermal activation. The effect of particle volume concentration (PVC) and particle size on tensile strength and thermal conductivity healing behavior is investigated. The results show that a higher PVC increases the mechanical property but decreases mechanical healing. For the same PVC, bigger particles lead to lower mechanical properties but higher thermal conductivities and higher mechanical healing efficiencies.