A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Conference paper (2018)

Authors

C. Chen Electronic Instrumentation - EEMCS
Z. Chen Electronic Instrumentation - EEMCS
M. Pertijs Electronic Instrumentation - EEMCS
D. Bera Erasmus MC
Z.Y. Chang Electronic Instrumentation - EEMCS
M. Tan Electronic Instrumentation - EEMCS
Hendrik J. Vos Erasmus MC
Johan G. Bosch Erasmus MC
M. Verweij , Erasmus MC
N. de Jong , Erasmus MC
Research Group
Electronic Instrumentation (EEMCS) (TU Delft)
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Published Date

2018

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Instrumentation

Abstract

Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.

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