Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect

Conference paper (2008)

Authors

T. Zoumpoulidis Old - EWI Sect. ECTM
J van Delft External organisation
M de Wild External organisation
PEM Kuijpers External organisation
P de Graaf External organisation
R Mauczok External organisation
K Biju External organisation
M. Bartek Old - EWI Sect. ECTM
R. Dekker Electronic Components, Technology and Materials - EEMCS
M Klee External organisation
Research Group
Old - EWI Sect. ECTM
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Published Date

2008

Language

Undefined/Unknown

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Research Group

Old - EWI Sect. ECTM