Reduction of transient thermal deformation in a thin plate under moving heat load using thermal modal analysis based control methods

Conference paper (2012)

Authors

T. Morishima Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
R.A.J. van Ostayen Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
J. van Eijk Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
R.H. Munnig Schmidt Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
Research Group
Mechatronic Systems Design (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2012

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Mechatronic Systems Design

Abstract

Thermal errors are important sources of positioning errors in precision machines [1] and are more and more becoming determining factors to meet increasing specifications. In this paper, thermal modal analysis is used to study the behaviour of an industrial inkjet printer under thermal load and to develop a reduced order thermal error model while maintaining the precision. The reduction of transient thermal deformation by adding extra heat loads is analysed as a possible method to improve thermal behaviour of high precision printing systems. Two approaches are taken and their simulation results are compared.