Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives

Conference paper (2005)

Authors

SM Sinaga Old - EWI Ch. Integrated Sensing Devices
A Poliakov Old - EWI Ch. Integrated Sensing Devices
M. Bartek Old - EWI Ch. Integrated Sensing Devices
Research Group
Old - EWI Ch. Integrated Sensing Devices
More Info
expand_more

Published Date

2005

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Ch. Integrated Sensing Devices

No files available

Metadata only record. There are no files for this conference paper.