Comparison of via-fabrication techniques for through-wafer electrical interconnect applications

Poliakov, A; Grob, T; Hovenkamp, RA; Kettelarij, HJ; Eidner, I; Samber, MA; Bartek, M.; Burghartz, JN

Comparison of via-fabrication techniques for through-wafer electrical interconnect applications

Conference paper (2004)

Authors

A Poliakov Old - EWI Ch. Integrated Sensing Devices

T Grob External organisation

RA Hovenkamp External organisation

HJ Kettelarij External organisation

I Eidner External organisation

MA Samber External organisation

M. Bartek Old - EWI Ch. Integrated Sensing Devices

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2004

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Research Group

Old - EWI Ch. Integrated Sensing Devices