Fast preparation of ultrathin FIB lamellas for MEMs-based in situ TEM experiments

Conference paper (2016)

Authors

H. Wang Beihang University, QN/High Resolution Electron Microscopy

Shanggang Xiao Beihang University

Q. Xu DENSsolutions, QN/Zandbergen Lab

Tao Zhang Beihang University

H.W. Zandbergen QN/Zandbergen Lab

Research Group

QN/Zandbergen Lab

HREM Fast lamellas preparation Focused ion beam In situ TEM heating experiments

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Published Date

2016

Language

English

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Research Group

QN/Zandbergen Lab

Abstract

The preparation of thin lamellas by focused ion beam (FIB) for MEMS-based in situ TEM experiments is time consuming. Typically, the lamellas are of ~5μm*10μm and have a thickness less than 100nm. Here we demonstrate a fast lamellas’ preparation method using special fast cutting by FIB of samples prepared by conventional TEM sample preparation by argon ion milling or electrochemical polishing methods. This method has been applied successfully on various materials, such as ductile metallic alloy Ti68Ta27Al5, brittle ceramics K0.5Na0.5NbO3-6%LiNbO3 and semiconductor Si. The thickness of the lamellas depends on the original TEM sample.