A Platform for Mechano(-Electrical) Characterization of Free-Standing Micron-Sized Structures and Interconnects

Journal article (2018)

Authors

A.M. Savov Electronic Components, Technology and Materials - EEMCS
S. Joshi Electronic Components, Technology and Materials - EEMCS
Salman Shafqat Eindhoven University of Technology
J. P.M. Hoefnagels Eindhoven University of Technology
M.C. Louwerse Philips Research
R. Stoute Electronic Components, Technology and Materials - EEMCS
R. Dekker Electronic Components, Technology and Materials - EEMCS , Philips Research
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2018 A.M. Savov, S. Joshi, Salman Shafqat, Johan Hoefnagels, M.C. Louwerse, R. Stoute, R. Dekker
DOI: https://doi.org/10.3390/mi9010039
More Info
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Published Date

2018

Language

English

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and mounting of these free-standing structures, the device is designed to be fabricated as a single chip/unit that is separated into two independently movable parts after it is fixed in the tensile test stage. Furthermore, the fabrication method allows for test structures of different geometries to be easily fabricated on the same substrate. The utility of the device has been demonstrated by stretching the free-standing interconnect structures in excess of 1000% while simultaneously measuring their electrical resistance. Important design considerations and encountered processing challenges and their solutions are discussed in this paper.