How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?

Conference paper (2011)

Authors

M. Taouil Computer Engineering - EEMCS
S. Hamdioui Computer Engineering - EEMCS
E. J. Marinissen External organisation
Research Group
Computer Engineering (EEMCS) (TU Delft)
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Published Date

2011

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Quantum & Computer Engineering

Research Group

Computer Engineering