A Broadband Silicon-Integrated Chopper for Passive Terahertz Cameras

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Abstract

In this contribution, we describe a reconfigurable surface, designed in 130um SiGe technology, to realize a fully-electronic, planar chopper aiming at passive terahertz imaging applications. This surface consists of subwavelength metallic patches that are interconnected using FET-based varactors. By switching the bias voltage of the varactors between 0V and 1.2V, the reconfigurable surface can switch between a transmissive and opaque state, respectively. The expected transmissivity is simulated to be between 0.2 and 0.9 over a wide frequency band, from 250 GHz to 550 GHz. This chopping solution would enable a high degree of system integration for future passive terahertz cameras.