Front-to back-side overlay optimization after wafer bonding for 3D integration

Conference paper (2005)

Authors

WD van Noort Electronic Components, Technology and Materials - EEMCS
L Marinier External organisation
R Pellens External organisation
B Sutedja External organisation
R. Dekker External organisation
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2005

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials