Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost

Journal article (2011)

Authors

M. Taouil Computer Engineering - EEMCS
S. Hamdioui Computer Engineering - EEMCS
C.I.M. Beenakker Electronic Components, Technology and Materials - EEMCS
E. J. Marinissen External organisation
Research Group
Computer Engineering (EEMCS) (TU Delft)
More Info
expand_more

Published Date

2011

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Quantum & Computer Engineering

Research Group

Computer Engineering