Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

Journal article (2015)

Authors

E.E. Kuran Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
Y Berg External organisation
M. Tichem Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
Z Kotler External organisation
Research Group
Micro and Nano Engineering (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2015

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Micro and Nano Engineering