Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

Kuran, E.E.; Berg, Y; Tichem, M.; Kotler, Z

Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

Journal article (2015)

Authors

E.E. Kuran Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering

Y Berg External organisation

M. Tichem Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering

Z Kotler External organisation

Research Group

Micro and Nano Engineering (Mechanical, Maritime and Materials Engineering) (TU Delft)

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http://resolver.tudelft.nl/uuid:04bb8a3e-ca0e-4ec3-a174-6a0f4777caf2

More Info

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Published Date

2015

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Micro and Nano Engineering