Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Joshi, S.; van Loon, A.H.M.; Savov, A.M.; Dekker, Ronald

Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Journal article (2016)

Authors

S. Joshi Philips Research, Electronic Components, Technology and Materials

A.H.M. van Loon Electronic Components, Technology and Materials

A.M. Savov Electronic Components, Technology and Materials, Philips Research

Ronald Dekker Philips Research, Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

Polymer Adhesion Sputtering

To reference this document use:

http://resolver.tudelft.nl/uuid:0258cceb-3cf1-490d-9671-b4709f4cf443

More Info

expand_more

Published Date

2016

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Electronic Components, Technology and Materials

Abstract

Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.

No files available

Metadata only record. There are no files for this journal article.