Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Journal article (2016)

Authors

S. Joshi Philips Research, Electronic Components, Technology and Materials
A.H.M. van Loon Electronic Components, Technology and Materials
AM Savov Electronic Components, Technology and Materials, Philips Research
R. Dekker Philips Research, Electronic Components, Technology and Materials
Research Group
Electronic Components, Technology and Materials
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Published Date

2016

Language

English

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Research Group

Electronic Components, Technology and Materials

Abstract

Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.

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