Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Journal article (2016)

Authors

S. Joshi Philips Research, Electronic Components, Technology and Materials - EEMCS
A.H.M. van Loon Electronic Components, Technology and Materials - EEMCS
A.M. Savov Electronic Components, Technology and Materials - EEMCS , Philips Research
R. Dekker Philips Research, Electronic Components, Technology and Materials - EEMCS
Ronald Dekker Philips Research, Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2016

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.