Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

Tang, J.; Beenakker, C.I.M.; Schelen, JBJ

Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

Conference paper (2012)

Authors

J. Tang Electronic Components, Technology and Materials -

C.I.M. Beenakker Electronic Components, Technology and Materials -

JBJ Schelen External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2012

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials