In our modern world, where computers, mobile phones and many other applications have become indispensable, there is a growing need for high precision machines in order to be able to produce these technologies. For these complex high precision applications it is important to under
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In our modern world, where computers, mobile phones and many other applications have become indispensable, there is a growing need for high precision machines in order to be able to produce these technologies. For these complex high precision applications it is important to understand the fatigue properties of the materials used to prevent premature failure, as these materials are subjected to large numbers of stress cycles. A material that is used for high precision applications is Ti-6Al-4V, as its material properties are highly adaptable and can be fine-tuned for a wide range of applications. Material fatigue due to stress cycles knows two stages: crack initiation and crack propagation. This research focuses on the latter and looks into the influence of microstructural features on crack propagation in Ti-6Al-4V. The influence of the microstructural features is tested by applying a load shedding method to form cracks in Ti-6Al-4V samples. These cracks are analysed with Scanning Electron Microscopy (SEM) and Electron BackScatter Diffraction (EBSD) in order to relate the microstructural features to the crack path. There are two main microstructural features found to have a large influence on the fatigue crack propagation in Ti-6Al-4V. The first of these is the Schmid factor, which relates the applied stress to the slip system available. As there are only a small amount of slip systems available in Ti-6Al-4V and limited crack path propagation opportunities, large crack deflections can be the result. The second microstructural feature found to have a large influence is the misorientation angle of the grain boundaries. When the misorientation angle is large enough, a shift from transgranular cracking to intergranular cracking is observed. Intergranular cracking can cause deviations of the crack path around the grains and the formation of secondary cracks. The deviations in crack path as a result of a low Schmid factor and a high misorientation angle extend the fatigue life of the material. The Schmid factor was found to have a large influence on crack deflections observed, whereas the high misorientation angles were mostly found around sites where bifurcation occurred, especially at lower applied stress ranges. This study proposes that the influence of the microstructural features on fatigue crack propagation in Ti-6Al-4V can be expressed as two probability functions describing crack deflection and bifurcation. The probability of a crack deflecting is relatively high for a lower Schmid factor, a high misorientation angle and a low deflection angle. The probability of bifurcation is relatively high when a near-threshold stress intensity range is applied and also for a high misorientation angle and a low deflection angle.