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RMJ Voncken
Academic Work (2)
Conference paper (2)
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2 records found
1
Novel damage model for delamination in Cu/low-k IC backend structures
Conference paper (2005) -
MAJ van Gils (author)
,
O van der Sluis (author)
,
Kouchi Zhang (author)
,
JHJ Janssen (author)
,
RMJ Voncken (author)
Analysis of Cu/low-k bond pad delamination by using a novel failure index
Conference paper (2005) -
MAJ van Gils (author)
,
O van der Sluis (author)
,
Kouchi Zhang (author)
,
JHJ Jansen (author)
,
RMJ Voncken (author)
