- document
-
Chen, Wei (author), Yan, Xuyang (author), Ibrahim, Mesfin S. (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...conference paper 2023
- document
-
Jouyaeian, A. (author), Fan, Q. (author), Brito Zamparette, R.L. (author), Ausserlechner, Udo (author), Motz, Mario (author), Makinwa, K.A.A. (author)This article presents a hybrid magnetic current sensor for galvanically isolated measurements. It consists of a CMOS chip that senses the magnetic field generated by current flowing through a lead-frame-based current rail. Hall plates and coils are used to sense low-frequency (dc to 10 kHz) and high-frequency (10 kHz to 5 MHz) magnetic fields...journal article 2023
- document
-
Tsan, Vi hung (author), Fan, D. (author), Caneva, S. (author), Smith, C.S. (author), Verbiest, G.J. (author)A low-cost glass-based microfluidic flow cell with a piezo actuator is built using off-the-shelf parts (total cost €9 per device) to apply acoustophoretic force on polystyrene micro-beads. The main challenge in the fabrication of these devices was to ensure their leak tightness, which we solved using double-sided tape and nail polish. Beads...journal article 2023
- document
-
Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)This paper presented integrated electromigration (EM) studies through experiment, theory, and simulation. First, extensive EM tests were performed using Blech and standard wafer-level electromigration acceleration test (SWEAT)-like structures, which were fabricated on four-inch wafers. Second, a molecular dynamics (MD) simulation-based...journal article 2023
- document
-
Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)This paper presented a comprehensive experimental and simulation study for thermomigration (TM) accompanying electromigration (EM) at elevated current densities. Both Blech and standard wafer-level electromigration acceleration test (SWEAT)-like test structures, with aluminum (Al) as a carrier, were used for testing and analysis. In Part I of...journal article 2023
- document
-
Callens, S.J.P. (author), Fan, D. (author), van Hengel, I.A.J. (author), Minneboo, M.B. (author), Diaz Payno, P.J. (author), Stevens, Molly M. (author), Fratila-Apachitei, E.L. (author), Zadpoor, A.A. (author)Individual cells and multicellular systems respond to cell-scale curvatures in their environments, guiding migration, orientation, and tissue formation. However, it remains largely unclear how cells collectively explore and pattern complex landscapes with curvature gradients across the Euclidean and non-Euclidean spectra. Here, we show that...journal article 2023
- document
-
Wan, Pei (author), Wu, Shaopeng (author), Liu, Quantao (author), Wang, Huan (author), Gong, Xing (author), Zhao, Zenggang (author), Xu, S. (author), Jiang, Jian (author), Fan, Lulu (author), Tu, Liangliang (author)Self-healing is a biological phenomenon in which living organism responds to the suffered damage in a complex way. Inspired by the self-healing phenomenon in nature, various biomimetic healing methods rooted in intrinsic or extrinsic healing mechanisms have been explored. Research on novel self-healing asphalt materials with intelligent...review 2023
- document
-
Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the...conference paper 2023
- document
-
Karmakar, S. (author), Zhang, H. (author), Berkhout, Marco (author), Fan, Q. (author)This paper presents a Class-D piezoelectric speaker driver that employs a quadrature feedback chopping scheme (QCS). Compared to a conventional single feedback chopping scheme (SCS), the use of QCS can eliminate the timing skew between low-voltage (LV) and high-voltage (HV) choppers, greatly improving large-signal linearity. A prototype...conference paper 2023
- document
-
Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...conference paper 2023
- document
-
Chen, Minggang (author), Zhang, H. (author), Fan, Q. (author)Silicon MOSFETs-based medium-power (< 50W) Class-D amplifiers (CDAs) switching in the MHz range have gained popularity in recent years, which achieves better linearity thanks to a higher loop gain in the audio band while enabling the use of LC filters with higher cut-off frequencies. However, for high-power (>100 W) CDAs, such switching...conference paper 2023
- document
-
Shi, Can (author), Fan, Zheng (author), Connolly, David P. (author), Jing, Guoqing (author), Markine, V.L. (author), Guo, Y. (author)Railway ballast performance is dictated by a complex mix of mechanical properties. These effect its performance at the particle level for example in terms of particle degradation, but also at the track system level in terms of settlement and stability. Therefore this paper seeks to develop new understandings of ballast behaviour and identify...review 2023
- document
-
Huang, Y. (author), Yu, Suihuai (author), Chu, Jianjie (author), Su, Zhaojing (author), Zhu, Yaokang (author), Wang, Hanyu (author), Wang, Mengcheng (author), Fan, Hao (author)Design knowledge is critical to creating ideas in the conceptual design stage of product development for innovation. Fragmentary design data, massive multidisciplinary knowledge call for the development of a novel knowledge acquisition approach for conceptual product design. This study proposes a Design Knowledge Graph-aided (DKG-aided)...journal article 2023
- document
-
Fan, D. (author), Cnossen, J.P. (author), Hung, S. (author), Kromm, D. (author), Dekker, N.H. (author), Verbiest, G.J. (author), Smith, C.S. (author)To better understand the interactions between biological molecules, a high optical resolution in all three dimensions is crucial. The intrinsically lower axial resolution of microscopes however, is a limiting factor in fluorescence imaging, correspondingly in fluorescence based single molecule localization microscopy (SMLM). Here, we present...journal article 2023
- document
-
Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
- document
-
Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
- document
-
Jouyaeian, A. (author), Fan, Q. (author), Ausserlechner, Udo (author), Motz, Mario (author), Makinwa, K.A.A. (author)This article presents a hybrid magnetic current sensor for contactless current measurement. Pick-up coils and Hall plates are employed to sense the high and low-frequency fields, respectively, generated by a current-carrying conductor. Due to the differentiating characteristic of the pick-up coils, a flat frequency response can then be...journal article 2023
- document
-
Ying, Shen (author), van Oosterom, P.J.M. (author), Fan, Hongchao (author)The recent years observe the vast development in new techniques and methods for modelling, visualization, and analysis of 3D digital cities, as the need of digital twins of urban environment in different applications and simulations has been increased dramatically. This special issue attempts to give an overview of the recent progress and...journal article 2023
- document
-
Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS ApplicationHu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...journal article 2023
- document
-
Huang, Y. (author), Yu, S. Suihuai (author), Chu, J. Jianjie (author), Fan, H. Hao (author), Du, B. Bin (author)Cultural heritage management poses significant challenges for museums due to fragmented data, limited intelligent frameworks, and insufficient applications. In response, a digital cultural heritage management approach based on knowledge graphs and deep learning algorithms is proposed to address the above challenges. A joint entity-relation...journal article 2023