Print Email Facebook Twitter Power and Thermal Cycling Testbed for End of Life Assessment of Semiconductor Devices Title Power and Thermal Cycling Testbed for End of Life Assessment of Semiconductor Devices Author Molenaar, M. (TU Delft DC systems, Energy conversion & Storage) Kardan Halvaei, F. (TU Delft DC systems, Energy conversion & Storage) Shekhar, A. (TU Delft DC systems, Energy conversion & Storage) Bauer, P. (TU Delft DC systems, Energy conversion & Storage) Date 2023 Abstract The reliability of semiconductor power devices can be studied by performing a thermal and power cycling test. In order to create the desired temperature cycles, there are four free variables to select during the power cycling test, namely the heating current, heating time, cooling time, and heatsink temperature. In this paper, the relation between the selected variables and the minimum and maximum junction temperature is extensively tested for the silicon IGBT with serial number IKP06N60T. Furthermore, the thermal model is discussed and verified and a rough estimate of the electrical resistance, thermal time constant, thermal resistance, and thermal capacitance are calculated. Subject Power cycling testReliabilityThermal modelSilicon IGBTSilicon-Carbide MOSFETThermal device characteristicsLifetime testbed To reference this document use: http://resolver.tudelft.nl/uuid:ef2222d0-38ac-41f7-9c5e-7063ec65e07b DOI https://doi.org/10.1109/IECON51785.2023.10312731 Publisher IEEE Embargo date 2024-05-16 ISBN 979-8-3503-3183-7 Source Proceedings of the IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society Event IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society, 2023-10-16 → 2023-10-19, Singapore, Singapore Series Proceedings of the Annual Conference of the IEEE Industrial Electronics Society, 1553-572X Bibliographical note Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type conference paper Rights © 2023 M. Molenaar, F. Kardan Halvaei, A. Shekhar, P. Bauer Files PDF Power_and_Thermal_Cycling ... evices.pdf 801.67 KB Close viewer /islandora/object/uuid:ef2222d0-38ac-41f7-9c5e-7063ec65e07b/datastream/OBJ/view