Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods

Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods

Weekamp, J.W.
Henneken, V.A.
Groenland, A.W.
Louwerse, M.C.

Delft University of Technology

2015-11-12

Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements; a contact chip (400) having a further main surface comprising a plurality of second contacts (420); an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted; and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.

http://resolver.tudelft.nl/uuid:4748ae78-9cbc-4a81-9545-20d51863f30b

European Patent Office

http://worldwide.espacenet.com/publicationDetails/biblio?DB=EPODOC&II=25&ND=3&adjacent=true&locale=en_EP&FT=D&date=20151112&CC=WO&NR=2015169771A1&KC=A1

WO 2015169771 (A1)

Institutional Repository

patent

(c) 2015 The Author(s)