Title
Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
Author
Li, Wenyu (Fudan University)
Chen, Wei (Fudan University)
Jiang, Jing (Fudan University)
Wang, Wenbo (Yongjiang Laboratory)
Fan, Xuejun (Lamar University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) 
Fan, Jiajie (Fudan University)
Date
2024
Abstract
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has rarely been investigated for double-sided heat dissipation scenarios. This paper proposes a numerical heat conduction model of a double-sided heat dissipation power module with multiple chips embedded. The model was developed by solving Laplace’s equation for the temperature distribution of steady state heat transfer using the separated variable method. The individual chip placement, two-chip distance and orientation, and four-chip placement were discussed through this modeling approach. The optimal layout was found. Then, a half-bridge topology module that consisted of two chips was investigated. To verify the accuracy of the numerical model, Finite Element Analysis (FEA) of the model was performed using the same boundary conditions. The experiments were applied on the power cycling tester to extract the junction temperature and case temperature. The numerical methods show good temperature prediction accuracy compared to both FEA and experiments.
Subject
Heating systems
Computational modeling
Layout
Multichip modules
Thermal management
Mathematical models
Numerical models
To reference this document use:
http://resolver.tudelft.nl/uuid:34f9804c-ada3-42a7-94f0-4fce1158d520
DOI
https://doi.org/10.1109/EuroSimE60745.2024.10491576
Publisher
IEEE
Embargo date
2024-10-09
ISBN
979-8-3503-9364-4
Source
Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024-04-07 → 2024-04-10, Catania, Italy
Series
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2024 Wenyu Li, Wei Chen, Jing Jiang, Wenbo Wang, Xuejun Fan, Kouchi Zhang, Jiajie Fan